[name by request] is providing RF and electronics engineering, project management and management consulting services. Brawin provides strategies, tools and creating business with innovations. Services are suited for the companies, which are looking for enter to new global markets. Customers: Ericsson Ab, Intel Mobile Communications and Sigma Connectivity. 

Developing Mobile phones with brand new mobile platforms, new front end, different WIFI systems, Bluetooth, Wireless charging etc.

Electro mobility projects.

IOT projects. 

• High volume 4G LTE Front End PA modules (PAMiD) test systems design.
• Operations - Test Engineering & Strategies
• Microwave Switches PCB design

• Automotive UWB (Ultra Wide Band) Microwave Radar 6-8 GHz, UHF, NFC. Drivers authorization systems. Microwave systems, link budget report with reflections and multipath up to ADC), radio propagation, outdoor propagation of microwave’s, effect of rain and haze, RF ASIC calculations TX/RX. Prototype and production. NFC and UWB Systems. Antennas, preselection filters, matching, PCB traces and PCB material and layout optimizations. Antenna performance and measurements, technical presentations, reports. Work packages and test plans to Pune, India. Project wise KanBan, Lean, Kaizen. Tools: DxDesigner, PDS PCB, Doors, Excel, Microwave Office (AWR).
• Provided expertise related to link budget calculations which allowed Marquardt to deepen their co-operation with their most demanding client within the automotive industry.
• Calculation in power domain with coin cell battery C2032 building power domain for high speed pulsed loads. DCDC Converter switched mode power supply simulations and dimensioning. LDO and DCDC selections and benchmarking. 

• Intel SMARTI 5 and Smarti 6 RF transceiver development and verification. Optimisation of receiver settings. Measurements in automated and controlled environment. Customer deliverables. Mobile phone chipset to Apple Inc.
• R&S Measurement equipment’s ATE development with Matlab programming and controlling signal generators and spectrum analysers and other RF measurement instruments. LTE CA CN/TDSCDMA/UMTS/GSM MIMO, Receiver performance, SNR, IIP2, IIP3, Gain, NF, spurious and crosstalk

• In charge of TDS units R&D, marketing, sales, exhibitions, finding new application areas, writing application notes and arranging demos to customers. TDS product is time-domain sensor for E- and H- measurements using cutting edge optical and Laser technology. Major achievements: IMS2013 Seattle 110 leads, 2 new co-operation projects and expanding distribution network. Used Phyton and Matlab for writing demo software.

• Intel SMARTI 4G SoC platform intelligent front-end development, RF design for adaptive antenna tuner network, optimizing the design and tuner code using Matlab programming and controlling measurement units and by running simulations in Agilent ADS (Brawin Oy as an Intel Supplier directly).

• Development and RF integration work of Ericsson F5321g full and half size H5321g PCIe 3G data modems. Working on STE transceiver ASIC’s and RX and TX paths. Data modems are used in phablets, tablets and laptop PC’s and other M2M applications. Hands on RF design and tweaking RF Engine registers and tuning and measuring RF parameters and optimizing ALC, EVM, TXP and spurious for the specs and product performance.

• Mobile Chipset Design Center – setting up a design team and solving an existing HW / RF problems in the 3G USB modem dongle product, which was overtaking mobile internet USB market. Technology bring up, future chipset benchmarking and evaluation, RF link budget, RF ASIC algorithm development for new discontinuous mode (TX and RX). Operations in Shanghai China and Kista Sweden.

• LTE and Multiband 3G WCDMA HSDPA and HSUPA chipset and prototype platform project. Design of world’s first LTE phone concept. LTE 4G RF Modem (RF Engine) and baseband design. Parts selection, schematic and block diagram creation, Calibration concepts for TX and RX, IQ RF-BB interfaces (ADC, DAC), FPGA specifications for RF interfaces, development of automated measurement systems, design block descriptions for FPGA IQ and CAL, AGC Cal, industrialization of prototypes and factory support, RF transceiver initialisation. HSUPA complete prototype Mentor Expedition schematics, PCB floor plan, PCB layout tuning, prototype industrialization, test plans and factory runs, performance measurements and tuning. Design work for Bluetooth, USB, cameras and Infineon RF transceiver integration to Ericsson baseband. System level design work designing a multiband UMTS platform for new frequency bands. World’s First LTE 4G prototype “Big Bertha” from Ericsson, presented in 2007 in Barcelona MWC.

• Hardware Object Leader (HW/BB/RF/Audio/CAD) in 3G WCDMA Toshiba’s Mobile Phone Project. Scheduling and setting the technical tasks for the development teams and engineers. This project was a global and done in co-operation with Flextronics Finland and Sweden. Platform studies for Ericsson Mobile Platform (EMP) and Palm One Inc. USA. Technology Partnership PLC, England 1 month RF and System Design Engineer - Technical Consultant
• Credit Card payment System VHF radio data modem re-design for Vodafone. Mixer and PLL replacement with new parts by choosing, testing and optimizing. System is used in Vodafone Paknet network dedicated for M2M service like credit card payments service.

• Credit Card payment System VHF radio data modem redesign for Vodafone. Mixer and PLL replacement with new parts by choosing, testing and optimizing. System is used in Vodafone Paknet network dedicated for M2M service like credit card payments service.

• RF and BB Project Manager in – New generation 3G Phone project. Comparing Intel and Renesas platform to Qualcomm platform and having negotiations with Intel and Renesas. Deliverables product RF system requirements, technical meetings with international suppliers, roadmaps, competitor analysis and technical reports, project kick off and scheduling. Participated platform buying meeting to buy Intel platform for 85-generation phones. Platform business deal value was 0.5 billion euros.

• RF design and integration for Triband smartphone. Cost reductions of Sendo-X by redesigning RF circuitry. Training Celestica factory staff in Czech Republic on debugging and fault finding of GSM Mobile PCBs. Solving receiver channel desensitising problem from 160.000 manufactured boards. Used resonator technology by cutting a slot into camera module, which was in resonance with antenna. Saved 80 million euros (calculated in mean value of 500 euros phone price).

• Developed improved GSM power ramps with ADS and Spice simulations and improved factory yield by 10%. Saved 150 million euros by means of able to produce 6 million phones without yield loss due to GSM power ramping failures. Part of the Sony Ericsson core simulation team globally. Part of the technology exchange team from Sony to Ericsson, transferred technology between Munich Germany and Lund Sweden. Send by Sony to Lund for technology exchange.

• RF transmitter chain developments and simulations with APLAC (Nokia spinoff tool) and HP ADS, system calculations with syscalc. Used R&S network analyser and HP spectrum analyser daily. Optimization in TX spurious emissions, PA output and power consumption. Designing Sony quality with product centric quality system. 6-Sigma and other PDS tools in use. Multicultural (42 nationalities in site) and Japanese Sony cultural training. Weekly RF lectures for everybody in RF team.