Designed and delivered high-reliability multilayer PCBs for aerospace applications using radiation hardened components, including high-pin-count FPGAs, LVDS, SERDES, MIL-Bus, PPS, and SpaceWire interfaces, while ensuring compliance with signal integrity, impedance control, EMC, thermal, and Manufacturability/Asembly requirements

• Full ownership of PCB design, from stackup definition to production-ready layout
• Defined PCB stackups, layer count (up to 18 layers), Constraint Manager Rulles, and dielectric/copper specifications for HDI boards
• Performed component placement and full PCB layout for high-density, high-speed boards
• Routed high-speed differential pairs, controlled impedance signals, and length-matched critical traces
• Managed EMC and thermal considerations for multilayer FR4/polyimide boards
• Conducted DRC and DFM checks to ensure manufacturability and production readiness
• Interfaced with PCB manufacturers and assembly partners
• Prepared documentation for PDR/CDR milestones and interfaced with manufacturing and assembly companies

• Responsable for designing PCB?s for different clients in Aerospace and Communication sectors using PADS, Zuken CR8000 and Mentor Xpedition tools

Fligth control pannel for avionics

Was my first project here, it was a project composed of 2 boards, I was responsable of layouting both of them. One board contained in average 5000 components and more then 2000 signal nets. The second board contained: aprox 700 components and 1200 signal nets

My main tasks in this project were as follow:

• Defining the layer stack-up, Number of layers, dielectric thickness, copper thickness in order to fit the impedance requirements, technology used and manufacturing posibilities
• Importing netlist, and placing components. The boards were based on BroadCom Ethernet switch, and ProASIC3 FPGA processor that would drive 3 on the shelf computer boards. Galvanic isolation LCD and other peripherals, USB 2.0 High Speed Controller were placed as well as the asociated components
• I was responsable of routing and chosing the correct technology to be used for layouting. The layout was done on a 8 layer FR4 substrate, with via?s in pad allowed, Communication protocol was Ethernet 10Mb/s ( 10Base-T), 100Mb/s (100Base-TX) and SPI
• I Routed the differential pairs of the Ethernet connection and the SPI to be adapted to the required impedances ( impedance control l00 ohm/50 ohm) and length matched.
• EMC and Thermal management was a part that I had to manage since new power supplies had to be redesign to accommodate a higher power consumption
• DRC checks were performed towards all boards and all errors examined and corrected

VHF/UHF Communications Project

Designed and delivered high-density, multilayer PCBs for VHF/UHF communications, including fully digital, mixed-signal, and low-noise analog/digital boards, while ensuring signal integrity, impedance control, EMC, thermal, and manufacturability requirements under strict confidentiality constraints.

Key responsibilities and achievements:

• Designed and routed 4 high-complexity boards (average 2000 components, 1000 nets per board), including digital, analog/RF separation, and mixed-signal circuits
• Optimized component placement and routing for high-density layout while maintaining mechanical and functional constraints
• Utilized microvias, blind and buried vias, 8?10 layer HDI boards, and advanced stackup techniques for high-speed and mixed-signal routing
• Implemented high-pin-count FPGA and DSP interfaces, ADC/DAC circuits, programmable logic, and high-speed digital signal routing
• Designed analog signal chains with controlled impedance (50??) and interfaced analog/digital conversion blocks
• Performed transmission line routing for fast signals (<4?ns rise/fall time)
• Supported PCB design team in component library migration and introduction of a new PCB layout tool, including symbol/footprint corrections and team training
• Ensured DRC/DFM compliance for high-reliability aerospace/defense standards

Component library, Infrastructure and introduction of new tools

• I was part of the efort of introducing a new tool for layout team ( PADS Proffesional)
• Migrate of the old library of components to PADS Proffesional
• Fixed simbols and foortprints after the migration of the library
• Offered support to PCB Design team coleagues in using the new too

Recruited as an experienced PCB / CCA engineer in order to build complex PCB Designs using Mentor Graphics Xpedition , DxDesigner and Altium Designer. Projects with different voltages ranging from 48 V to 800V built on Heavy copper FR4 substrate with 6-8 layers divided into a High Voltage and Low voltage part. The product was outputting a 3 Phase Voltage through an inverter circuit to power a motor. The boards had on average 1500 components and 800 nets.  

• ? On Planning and leading part of the projects I was responsable of find solutions to convert client requirements into a functional Printed Circuit Board layout complient with IPC standards for manufacturing and EMC / EMI norms
• ? I colaborated closely with Mechanical designers in order to understand location of pheriferals and other fix components, heigth restrictions, thermal restrictions and to negociate shape/ size of the board
• Since component weigth matters in vibration tests i was involved in fixing a specific location of big/heavy components, number of mounting holes and their location based on mechanical designer simulations
• Understand of the schematic and worked closely with the hardware engineer in regards to the component package to be used.
• Worked closely with the Project manager in order to meet the deadlines of the projects
• Provided technical analises and cost reduction solutions to Upper Management. This allowed us not only to meet the client requirements but also to be competitive in bids and win new projects.
• I was the go to person on technical aspects for Enginnering Questions comming from different suppliers or various modifications that needed to be done in the requirements
• Member of the review team for PCB design as well as advisor for EMC / SI / PI debuging
• On High Voltage part of the projects I created the Layer Stackup for each project depending on the project parameters In colaboration with the PCB Suppliers. Thermal (Tg value, ), Voltages ( CTI parameter, thickenss of the dielectric, tipe of resin being used, CAF materials), Curent ( Copper Thickness), Impedance considerations
• Electrochemical migration was a specific chalange for witch i had to calculate the clearance and creepage distances needed for the project depending on voltages (48V 400V or 800v) as well as the double reinforced issolation between high Voltage and Low Voltage using IEC60601 or VW80808 standards and imput them in the tool used.
• Calculated curent capabilities for traces or plane-shapes used depending on the value of the current running. Depending of project they could be between 80 amps to 280 amps.
• Designed placed and routed the PDN ( Power Distribution Network) with respect to the layerstack-up previously calculated and respecting EMC / EMI / PI / SI ( Signal /Power Integrity) rulles
• Placed and routed the Gate drivers, DC link capacitors, Common mode filter, Current Discharge Circuits and MOSFETS / IGBT in accordance to space restriction, Thermal aspects, voltages and safety
• On Low Voltage part of the design i placed the board components AURIX family Uc with a pitch of 0.8mm, Power Supply, Common mode/ Differential Filters, CAN interface.
• Fanout and routed the components with respects to the signal they carried, voltage, SI ( Signal Integrity ) and length matching where it was required, CAN lines were addapted in impedance ( 120ohm) and routed as a diferential pair
• Created the manufacturing package that contained Gerber files, ODB++, Assembly drawings, Fabrication Drawing, Pick&Place, Drill filles for the entire board.

The purpose of the board was to drive the propulsion actuators being comanded from a main unit

• I implemented the stackup and design rulles according to client speciffications
• Placed components, Conectors, FPGA, H-Briges to drive the oxidizer tanks and fuel tanks
• Fanout and routing of the FPGA, the PPS diferential pair lines ,clocks, H-Bridges together with the associated components and pheriferals. Length tuning was applyed on PPS traces
• Generate gerberfilles, Assembly drawing, Fabrication drawing and Pick and Place files

Challenged with developing multilayer PCB?s(Printed Circuit Board) for Powertrain,Parking Assist (Parking Camera/Sensors) and ECU(ElectronicControlUnits),using ZukenCR5000 /CR8000 and CAM350

• Designed PCBs in compliance with IPC standards (IPC2221, IPC2222, IEC60601, IPC-A-610, VW80808 ) that passed EMC | EMI , SI / PI ( Signal Integrity / Power Integrity.) tests
• Efficiently implemented the following types of technologies: Analog and Digital signals, stripline microstrip, HDI (High-Density Interconnect), Differential Pairs ,CAN ,Flexray ,Blind/Buried vias, Microvia
• Successfully provided solutions for EMC | EMI | ESD, Design Cost Reduction, CAF(Cathode to Anode Filament), HiPot tests and Thermal management
• Provided technical support to Supply Chain and PCB fabrication and assembly suppliers

Relevant projects in my responsibility

• Radar patch array PCB antenna designs for ADAS 24GHz on Rogers substrates, Impedance calculation, transmission lines, power dividers etc.
• Parking cameras and Ultrasound sensors for parking with stacked PCB?s, length matching, differential pairs, impedance control etc. Because space was verry small most of the boards were HDI.
• Various ECUs (Electronics control units) with power supplies, CAN Transceivers, Analog and Digital signals on FR4 boards, and various BGA.
• (Powertrain and E-Mobility) 48V and 400V compressors with various IGBT / MOSFETs and Galvanic isolation, Creepage and clearance constraints, CAF materials, Conformal coatings, thermal, Humidity and vibration constraints

Spearheaded the creation of PCB Design team in a new location and I designed the following type of projects: HMI (Human Machine Interface),Infotainment, Touchpad projects and Battery Management using Mentor Expedition / Design Capture

• Authored numerous procedures, Input/output PCB Layout review process as well as Mechanical Design to PCB Design Interface process for which I was awarded by the company.
• Handpicked new junior designers and after a sustain effort involving: mentoring, developing curricula for trainings and providing feedbacks. In 2 years the team grew from 1 PCB designer to 5 PCB designers all able to perform a reliable layout
• Challenged in working with the following type of technologies: SMT | SMD (Through-hole, Surface Mounting, components), Blind/Buried vias, Touchpad, Microvia, Differential Pairs, HDI (High-Density Interconnect), CAF(Cathode to Anode Filament), Lead Free/ROHS ,ICT reports
• Prepared manufacturing readiness package, containing: Gerber Files, ODB++ , Pick&Place , Manufacturing drawings , etc. in compliance with IPC610 and IPC6012 and DFM / DFA / DFT (Design For Manufacturing/Assembly / Testing )

Relevant prjects in my responsability

• (E-mobility) 48V Batery management control units involving : Galvanic issolation,DC-DC Convertors, pressure sensors, gate drivers, power MOSFET-s, and CAN-transceivers
• (Infotainment): Driver assistance sistems involving: Display?s, Hand Movement Sensors,various communication protocols CAN,FlexRay , Differential pairs etc.
• (HMI): Various Knobs and Climatronics sistems involving: Buck/Boost convertors, Touchpads,Haptic circuits, Mixt Signals etc.

Integrated quickly in a new team of 7 PCB Design Engineers and product development of the following: Contactless Door Handle Systems, Steering Locks, PCB trace antenna Systems using PADS

• Part place and routing of SMD / THT components on boards with the following technologies: Rigid, Flexible, Rigid-Flex PCB, Stiffeners, Ethernet, Conformal Coatings.
• Conducted collision test between PWB and mechanical housing, Created Assembly Panel, and height restrictions using CATIA V5, thus gaining a great overview on Mechanical-PCB Design Interface

Relevant projects in my responsibility:

• Smart car acces projects ( smartphone based) using NFC ( Near Field Communication) and UWB ( Ultra wide band ) technology
• Control pannels and Knob-s for car interior containing various power supplyes ( Buck , Boost, Buck-Boost) , Capacitive touchpads , Analog and digital signals